Powered by Indico v3.0.3
1. The pin layout and test requirement for the test board was released. The test board design and manufaction was expected to be finished before the chip received. Some components, including the FMC sockets, FPGA EVA boards and so on, should be prepared in advance before test.
2. We collected several nominations of the chip name, and will soon propose a vote for them.
3. Wei Wei proposed some consideration for the next version, and we discussed a rough schedule towards the next tapeout. The design of the next version of the chip should start now.
4. In the following two weeks, we will prepare a design report of every part, and also the user manual for the FPGA design and chip test.