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HGTD Module and Mechanics Meeting

→ Asia/Shanghai
B324 (IHEP)

B324

IHEP
    • 15:30 → 15:50
      Introduction 20m
      Speaker: Joao Guimaraes Costa
    • 15:50 → 16:05
      Flex cable design 15m
      Speaker: Dr Mingyi Dong (IHEP)
      Slides
    • 16:05 → 16:20
      Report on bump bonding 15m
      Speaker: Prof. Zhijun Liang (IHEP)
    • 16:20 → 16:35
      Slim module connector 15m
      Speaker: Dr Jie ZHANG (Institute of High Energy Physics)
      Slides
    • 16:35 → 16:50
      Outer ring mechanics 15m
      Speaker: Jinyu (高能所)
      Slides
    • 16:50 → 17:05
      Planning for module production 15m
      Speakers: Prof. Feng LYU (Institute of High Energy Physics) , Xin Shi (IHEP)
      Slides
    • 17:05 → 17:15
      AOB 10m
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