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MOST2 chip design meeting

Asia/Shanghai

1. Tianya reported the power evaluation by simulation of the full pixel array, based on the current architecture. Although we didn't agree with all the details, the final value was in the reasonable range. Some result will be discussed further.

  2. We had a discussion with Joao about the current plan and the recent future.

     The chip are going to be delivered this week. Tianya will find out the numbers that IFAE will keep and Joao will also ask the requirement from other collaborators. The rest will be send to SDU, and then be wire bonded. The test firmware has come to a general shape, the rest of the debugging have to go with the real chip. Hopefully we can see some functionality test result in the beginning of December.

     Concerning the second MPW, we have already made some improvement on the time issue. The modification of periphery logic is on-going. However, we have to wait for some test results, especially the sensor and analog part, and the data interface. Based on those results can we make decision of the design choice.

     We also discussed possibilities of new ideas of the detector. 

     One direction is to have a smaller pixel size, in order to get more safety room for the resolution after radiation. However, it seems difficult for the current digital logic of ALPIDE, because it has already occupied nearly all the area. One possible solution is to find some room from the analog part by 1um, we have to wait and see the test results first though.

     We also discussed the direction to have less material budget. One interesting idea may be the use of RDLs over several chips, to get rid of the flex cable. We can consult the possibilities from our collaborators. 

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    • Digital Pixel 20'
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