1. Tianya reported the test status of the Tcpx1 chip. The tested time walk seemed agreed with the simulation.
2. We discussed some issues for the engineering run:
1) The modification of DAC was in progressing. The interface was defined with both the DAC and the periphery block.
2) The scaling of the pixel array was preliminarily done. It was ready to integrate the final pixel analog part.
3) It was estimated that the IR drop may not be an issue for the full size chip. However we decided to change our design flow from 6M1L to 7M2L. Waiting for the response of TJ.
4) We are still doing some test to see the behavior when the substrate was biased at minus voltage.
5) We decided that the LDO will only be involved as an independent block, while the main chip will be powered directly from the external source.
3. We agreed to collect all the blocks for integration for the first round during the week of March 15~21.