Software and Simulation Meeting

Name: Software and Simulation Meeting
Start: 2024-03-04T15:00:00+08:00
End: 2024-03-04T16:30:00+08:00
Location: Multi-disciplinary Building

Monday 4 Mar 2024, 15:00 → 16:30 Asia/Shanghai

228 (Multi-disciplinary Building)

228

Multi-disciplinary Building

Institute of High Energy Physics

Description

Tencent Meeting Link:

会议主题 Meeting Topic：CEPC Software and Simulation Meeting会议号 Meeting ID: 809133775
会议链接 Meeting URL：https://meeting.tencent.com/dm/widDw9GJwNi3
入会密码Password：240304

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