Software and Simulation Meeting

Asia/Shanghai
228 (Multi-disciplinary Building)

228

Multi-disciplinary Building

Institute of High Energy Physics
Description

会议主题 Meeting Topic:Software and Simulation Meeting
开始时间 Begin Time: 2024-03-11 15:00:00
会议号 Meeting ID: 403365480
会议链接 Meeting URL:https://meeting.tencent.com/dm/jvVfIDBCo5C5
入会密码Password:240311