Software and Simulation Meeting

Asia/Shanghai
228 (Mutil-Disciplinary Building)

228

Mutil-Disciplinary Building

Description

会议主题 Meeting Topic:CEPC软件会
开始时间 Begin Time: 2024-03-18 15:00:00
会议号 Meeting ID: 795777578
会议链接 Meeting URL:https://meeting.tencent.com/dm/viM78kWYZS1d
入会密码Password:240318