Software and Simulation Meeting

Asia/Shanghai
228 (Multi-Disciplinary Building)

228

Multi-Disciplinary Building

Description

会议主题 Meeting Topic:CEPC Software and Simulation Meeting
开始时间 Begin Time: 2024-03-25 15:00:00
会议号 Meeting ID: 936779384
会议链接 Meeting URL:https://meeting.tencent.com/dm/NDe1idjXITOy
入会密码Password:240325