CEPC ToF & outer tracker

Asia/Shanghai
604 (多学科)

604

多学科

Description

 zoom:  https://us02web.zoom.us/j/88395113498?pwd=Dm3ssy8pUdzECS9BSPPbcpzOnkpSRL.1

HostKey 主持人密钥: 406069

Password 会议密码: 949362

 

 

Topic:

 

1. the thermal simulation results of the cooling for ASIC without optimization

 

2. the occupancy of the electronics 

 

3. the simulation of the hit rate of the  CEPC ToF with ECAL included