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1. The schematic of the test board for Tcpx2 was ready. The design of the PCB will start after today's group discussion.
2. Tianya and Xiaomin reported some test results of the pixel digital circuit. The column address seemed to be possible to scan, and the digital test pulse seemed to be functional, however, the row address showed different behaviors. We still need to further understand and find the problem of the digital part.
3. Zhang Ying finished the test of the third functional chip of the analog part. It was found the bias setting may be different for different chip. The minus 6V IO was also found to be vulnerable to the ESD event.
4. Wang Jia reported some test results about the LDO block. Due to the weak short problem of the IO ring, the LDO output was found not capable to be stabilized at 1.8V as expected. It was maybe because there was another weak short path through the analog pad. still needed to be further tested to make sure.
5. Zhijun discussed some power dissipation model based on the full size chip. There was a need to design a dummy flex PCB to emulate the heat source of the ladder.
6. Some midterm assessments were also discussed. We need to check the simulation results on the radiation behavior.