1. Tianya reported the test status of tcpx1 chip in IFAE. The test setup was updated with full PLL readout. With redundant readout by Dpulse test, it proved that the column address of the FE-I3 part can be mostly scanned. Although the ALPIDE's output was still stuck, it can show some address other than the stuck pixels. It was noticed that the readout data was somewhat affected by the power supply voltage, and the reason was to be understood.
2. Wei Wei proposed a requirement for the new test board modification. The main purpose was to do the irradiation test and to evaluate multiple chip communications.
3. The status of the pixel analog test for the TCPX2 was also discussed. Zhang Ying was fine tuning the chip biasing.