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CEPC Physics and Detector Plenary Meeting
Time: Wednesday, November 18, 2020 from 15:00 to 18:00 (Asia/Shanghai)
Location: Multi-subject building ( 229 )
Attendance: Zhijun Liang, Joao Guimaraes da Costa, Jianchun Wang, Manqi Ruan, Huirong Qi, Gang Li, Hongbo Zhu, Yongsheng Huang, Zhaoru Zhang, Mingyi Dong, Linghui Wu
Zoom Online: Chengdong Fu, Fangyi Guo, Feipeng Ning, Haijun Yang, Shengsen Sun, Weidong Li, Weiguo Lu, Xin Shi, Xuai Zhuang, Yaquan Fang, Yazhou Nou, Yiming Li, Yong Liu, Yubin Zhong, Yubo Han, Yunpeng Lu, Zi-an Zhu, Quan Ji, Had Zeng, Harald Fox, Mingshui Chen, Shuiting Xin,
1. Silicon timing detector in IHEP testbeam by Zhijun Liang
Zhijun reported the progress for LGAD sensor beam test activities in IHEP. The team verified 3 kinds of silicon timing detector in testbeam, and measured particle flight time for different sensors. Due to very limited statistic, the results are not solid enough which needs more test for next term.
2. Study of ECAL at the BEPC testbeam facility by Yazhou Liu
USTC ECAL group had their Sc-ECAL prototype beam test in IHEP. The transport and setup of the Sc-ECAL prototype was smoothly. Total 12k events of 500 MeV, 800 MeV and 1 GeV momentum mixed positive particles have been collected. They got hit distributions successfully. Now the channel by channel calibration are ongoing and event selection and analysis would be performed in next step.
People gave some suggestion for the presentation:
1) Change TOF detector to scintillation counter, since it is just used for trigger.
2) Prepare a slide to explain why your own trigger (ECAL layer 1&2 ) cannot be trusted.
3) Show beam direction in hit distribution plots.
4) In Page 6, fix z position for all plots so that the results can be comparable.
5) Show a plot for beam profile
3. Bench test of the ATLASPix3 at IHEP by Yubo Han
Yubo introduced the beam test for ATLASPix3 at IHEP. ATLASPix3 chips arrived at IHEP in last month, then the group did wire bonding, test setup, software preparation. They tested IV curve, Analog signal, Digital readout, SCurve, Trimming, and ToTCalibration will be done very soon. Chips and System work, configurations will also be further fine tuned.