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MOST2 chip design meeting

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  1. The design of the TaichuPix full size chip is finished and ready to submit. We are waiting for TJ's evaluation for the design flow, and then the submission tunnel.

  2. Wang Jia reported some modifications of the LDO block in the full size chip. The bandgap block was replaced by the one from DAC; substrate and deep nwell contact was enhanced, and the IO rings were redesigned. It will be tested in the full size chip as a black box from the chip top view.

  3. Details of the chip layout were reviewed by the design team. Questions related to the chip tested were discussed.

  4. We are going to organize an expert review at the end of May. 

There are minutes attached to this event. Show them.
    • 1
      LDO test
      Slides
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