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22–27 Oct 2024
Hangzhou Platinum Hanjue Hotel
Asia/Shanghai timezone

Manufacturing and assembly processes of TSV (Through-Silicon Via) and sensor applications

25 Oct 2024, 11:45
15m
Room 289

Room 289

Speaker

Mr Zhengyu Ren (NCAP)

Description

from NCAP
TSV 制造与组装工艺及传感器应用(华进半导体)

Presentation materials