The 2024 International Workshop on the High Energy Circular Electron Positron Collider

Manufacturing and assembly processes of TSV (Through-Silicon Via) and sensor applications

25 Oct 2024, 11:45

15m

Room 289

Talk International Industrial Connection

Speaker

Mr Zhengyu Ren (NCAP)

Description

from NCAP
TSV 制造与组装工艺及传感器应用（华进半导体）

Presentation materials

TSV制造与组装工艺及其应用.pdf