Speaker
子煜 刘
(Institute of High Energy Physics)
Description
A resistive heating film was developed to simulate pixel sensor and readout heat loads in the innermost layer of the vertex detector. To simplify signal routing outside the cooling chamber, two sensing configurations were designed: a flexible printed circuit (FPC) carrying 11 surface-mount PT100 sensors, and individually wired PT100 probes (manually assembled using enameled Cu wire and UV curable adhesive). The FPC option offered easier handling and was therefore selected. However, its connectors and solder pads remain mechanically fragile. Future work will expand the sensing points and improve its mechanical robustness, while silicon-based heaters are also being considered as an option.
Primary author
子煜 刘
(Institute of High Energy Physics)
Co-author
金煜 付
(Institute of High Energy Physics)
