Join Zoom Meeting:
https://zoom.us/j/94032423519?pwd=WmEnzzIviP3koNHJJcege3QHSkoHBL.1
Meeting ID: 94032423519
Passcode: 619776
2026.04.14 CEPC Inner Tracker meeting
Indico: https://indico.ihep.ac.cn/event/29343/
Intro & news (Yiming)
CEPC workshop at Portugal last week: https://indico.cern.ch/event/1598929/
Encouraged by colleagues (eg IDRC members ) to thouroughly test COFFEE chips
National semiconductor detector workshop in Shanghai this week: https://indico.pnp.ustc.edu.cn/event/5514/
Serial powering study @ IHEP (Tianyu, Hui)
Tests performed on ATLASPix3 sensors bonded on single-carrier boards. IV curves from SLDO VDDD gives reasonable shape. Yanyan: current values orders of magnitudes away from previous tests, to cross-check with Fuat's results
COFFEE3 tests (Zijun, Yuman, Boxin, Kang, Yuan)
Boxin reports recent tests on COFFEE3 left array ('CMOS in-pixel'). Laser and S-curves measured on two full columns
Kang reports the calibration on the X-ray machine at IHEP. Irradiation up to ~40kRad/min.
Dummy sensor (Congcong, Cheng)
A new batch of dummy sensors back from production. They are designed with similar size and materials as the full-size chip expected, with metal traces to give similar power consumption to facilitate thermal and mechanical studies. Pads and special patterns are designed to allow assembly practice. Different traces in the upper and lower region to resemble the different power in pixel array area and digital periphery.
First tests with power performed to study if the yield and power are as designed. Further study needed to draw a conclusion.