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1. Tianya reported the test status of the tcpx1 chip. The analog output was observed by correct bias condition, and then the full signal chain was also proved from the pixel analog to the final serializer readout. The Cal-En and Mask bit were also verified in different patterns. The results showed the FE-I3 parts can respond correctly to the expected pattern, while filtering unwanted data from ALPIDE parts. This proved the FE-I3 part worked well.
2. Zhang Ying reported the test status of the Tcpx2 pixel analog part. The test further proved the previous detected phenomena, that the scurve will show different threshold when one single pixel was tested, or multiple pixels were tested. The tested threshold was also higher than simulation. It was also found that the tested bias current is about 400 hundred times higher than the design value, although the bias voltage agreed with the design. Those phenomena should be understood by further test.
3. We discussed about the new test board for the irradiation test. We will first get some dimension limitation about the test environment, and then made the modification to the existed board.