1. IE browser is NOT supported anymore. Please use Chrome, Firefox or Edge instead.
2. If you are a new user, please register to get an Indico account through https://login.ihep.ac.cn/registIndico.jsp. Any questions, please email us at helpdesk@ihep.ac.cn or call 88236855.
3. If you need to create a conference in the "Conferences, Workshops and Events" zone, please email us at helpdesk@ihep.ac.cn.
4. The max file size allowed for upload is 50 Mb.
May 21 – 26, 2017
Beijing International Convention Center
Asia/Shanghai timezone

The Phase-2 ATLAS ITk Pixel Upgrade

May 24, 2017, 4:48 PM
18m
Room 307 (Beijing International Convention Center)

Room 307

Beijing International Convention Center

No.8 Beichen Dong Road, Chaoyang District, Beijing P. R. China 100101
oral Semiconductor detectors R4-Semiconductor detectors(4)

Speaker

Dr Mathieu Benoit (University of Geneva)

Description

The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase II shutdown (foreseen to take place around 2025) by an all-silicon detector called the “ITk” (Inner Tracker). The innermost portion of the ITk will consist of a pixel detector with stave-like support structures in the most central region and ring-shaped supports in the endcap regions; there may also be novel inclined support structures in the barrel-endcap overlap regions. The new detector could have as much as 14 m2 of sensitive silicon. Support structures will be based on low mass, highly stable and highly thermally conductive carbon-based materials cooled by evaporative carbon dioxide. The ITk will be instrumented with new sensors and readout electronics to provide improved tracking performance compared to the current detector. All the module components must be performant enough and robust enough to cope with the expected high particle multiplicity and severe radiation background of the High-Luminosity LHC. Readout will be based on the new front-end ASIC being developed by the RD53 Collaboration. Ideally the readout chips will be thinned to as little as 100 μm to save material; this presents a challenge for sensor-chip interconnection and options are being evaluated in collaboration with industrial partners to develop reliable processing techniques. Servicing the detector reliably without introducing excessive amounts of material and dead space is another significant challenge. Data cables must be capable of handling up to 5 Gb/s and must be electrical in nature, with optical conversion at larger radii where the radiation background is less intense. Serial powering has been chosen as the baseline for the ITk pixel system as it minimises service cable mass; extensive testing has been carried out to prove its feasibility. Attention must also be paid to grounding and shielding in the detector to mitigate cross-talk and common mode noise. Most of the baseline technological decisions will be taken this year in view of the ITk Pixel TDR to be completed by the end of 2017.

Primary author

Dr Mathieu Benoit (University of Geneva)

Presentation materials