International Presentation CEPC MOST silicon

Thursday 7 Jun 2018, 20:00 → 23:00 Asia/Shanghai

Informal introduction of the CEPC 2018 Pixel Prototype project.

20:00 → 20:15 Silicon Project Overview

Speaker: Joao Guimaraes Costa

Slides 20180607-MOST_Pixel_International_Introduction.pdf

20:15 → 20:25 Pixel sensor specifications

Speaker: Mr Wei WEI Wei (高能所)

Slides Weiw_brief_intro_chip_design.ppt

20:25 → 20:40 IHEP Presentation

Relevant issues: MOST1, BES prototype

Speaker: Mr 明义 董 (高能所)

Slides Introduction__of_the_MOST1_chip__and_the_BES_pixel_detector_prototype.pdf

20:40 → 20:50 Shandong University Presentation

Relevant experience: Chip design

Speaker: Dr Liang Zhang (Shandong University, CHINA)

Slides R&D_of_pixel_sensor_@_Shandong_University.pptx

20:50 → 21:00 Northwest University Presentation

Relevant background: ASIC design

Speakers: Xiaomin Wei (N) , Prof. 武 高 (西北工业大学)

Slides NPU_Team_Intruduction_20180607.ppt

21:00 → 21:10 Liverpool University

Speaker: Yanyan Gao (University of Liverpool)

Slides liverpool_interests.pdf

21:10 → 21:20 Oxford University

Speakers: Daniela Bortoletto (O) , Kirk Arndt (U)

Slides Oxford_overview_June2018.pdf

21:20 → 21:30 Rutherford Labs

Speaker: Jens Dopke

Slides CEPC_MOST_Interest.pptx

21:30 → 21:40 University of Massachussetts

Speaker: Rafael Coelho Lopes de Sa (U)

Slides CEPCpixelKickoffMeeting_LopesdeSa06072018_v4.pdf

21:40 → 21:50 IFAE, Universitat Autonoma of Barcelona

Speaker: Raimon Casanova

Slides IFAE_KICKOFF_MOST2.pdf